Invention Grant
- Patent Title: Inspection of substrates
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Application No.: US15933366Application Date: 2018-03-22
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Publication No.: US10553504B2Publication Date: 2020-02-04
- Inventor: Gurvinder Singh , Wu Y. Han , John Thornell , Chetan Suresh , Wayne Fitzgerald
- Applicant: Rudolph Technologies, Inc.
- Applicant Address: US MA Wilmington
- Assignee: Rudolph Technologies, Inc.
- Current Assignee: Rudolph Technologies, Inc.
- Current Assignee Address: US MA Wilmington
- Agency: Larkin Hoffman Daly & Lindgren, Ltd.
- Agent Todd R. Fronek
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01N21/64 ; G01N21/95 ; H01L21/02
Abstract:
Concepts presented herein relate to approaches for performing substrate inspection. In one aspect, the concepts relate to detecting anomalies or candidate defects on the substrate based on contrast in images obtained of the substrate.
Public/Granted literature
- US20180277452A1 INSPECTION OF SUBSTRATES Public/Granted day:2018-09-27
Information query
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