Invention Grant
- Patent Title: Breakdown resistant semiconductor apparatus and method of making same
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Application No.: US15583126Application Date: 2017-05-01
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Publication No.: US10553494B2Publication Date: 2020-02-04
- Inventor: Jhong-Sheng Wang , Ting-Sheng Huang , Jiaw-Ren Shih
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/70 ; H01L21/84 ; H01L21/8242 ; H01L21/8238 ; H01L29/49 ; H01L27/092 ; H01L29/423 ; H01L29/786 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/78

Abstract:
A semiconductor device includes a substrate, a first transistor on the substrate, and a second transistor on the substrate. The first transistor has a first threshold voltage, and a channel region and source/drain regions of the first transistor are N-type. The second transistor has a second threshold voltage, a channel region of the second transistor is N-type and source/drain regions of the second transistor are P-type, and an absolute value of the first threshold voltage is substantially equal to an absolute value of the second threshold voltage.
Public/Granted literature
- US20180151448A1 BREAKDOWN RESISTANT SEMICONDUCTOR APPARATUS AND METHOD OF MAKING SAME Public/Granted day:2018-05-31
Information query
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