Invention Grant
- Patent Title: Wafer alignment method and apparatus for overlay measurement
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Application No.: US15715051Application Date: 2017-09-25
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Publication No.: US10553470B2Publication Date: 2020-02-04
- Inventor: Liwan Yue , Qiang Wu
- Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION , SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Applicant Address: CN Shanghai CN Beijing
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee Address: CN Shanghai CN Beijing
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN201610925898 20161031
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/67 ; H01L21/687 ; H01L23/544 ; G06T7/13 ; B25J9/16 ; G06T7/00 ; H04N5/225

Abstract:
A substrate alignment device includes a plurality of state detection units, each of which is configured to move from a standby position to a detection position for detecting a positional state of a substrate and return back from the detection position back to the standby position, and a multidimensional robot arm configured to receive and support the substrate, transfer the substrate to a substrate detection site, and adjust the substrate in at least one orientation or position according to the detected positional state of the substrate to position the substrate to a target position for overlay mark measurements.
Public/Granted literature
- US20180122678A1 WAFER ALIGNMENT METHOD AND APPARATUS FOR OVERLAY MEASUREMENT Public/Granted day:2018-05-03
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