Invention Grant
- Patent Title: Substrate processing method
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Application No.: US15671394Application Date: 2017-08-08
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Publication No.: US10553459B2Publication Date: 2020-02-04
- Inventor: Taiki Hinode , Sadamu Fujii , Rei Takeaki
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2016-168283 20160830
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02

Abstract:
A substrate processing method includes a liquid film forming step of supplying a low surface tension liquid onto the upper surface of the substrate while rotating the substrate at a first rotational speed, in order to form a liquid film of the low surface tension liquid on the upper surface of the substrate, a rotation decelerating step of decelerating rotation of the substrate to a second rotational speed while continuing the liquid film forming step, after a processing liquid on the substrate has been replaced with the low surface tension liquid, an opening forming step of forming an opening in the center region of the liquid film on the substrate that rotates at the second rotational speed after completion of the liquid film forming step, and a liquid film removing step of removing the liquid film from the upper surface of the substrate by widening the opening.
Public/Granted literature
- US10593569B2 Substrate processing method Public/Granted day:2020-03-17
Information query
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