The method of chip packaging comprises: S1: providing a carrier, and forming an adhesive layer on a surface of the carrier; S2: forming a first dielectric layer on a surface of the adhesive layer, and forming a plurality of first through holes corresponding to electrical leads of a semiconductor chip in the dielectric layer; S3: attaching the semiconductor chip with the front surface facing downwards to the surface of the first dielectric layer; S4: forming a plastic encapsulation layer covering the chip on the surface of the first dielectric layer; S5: separating the adhesive layer and the first dielectric layer to remove the carrier and the adhesive layer; and S6: forming a redistribution layer for the semiconductor chip based on the first dielectric layer and the first through holes.