Invention Grant
- Patent Title: Semiconductor package and manufacturing method of semiconductor package
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Application No.: US15472387Application Date: 2017-03-29
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Publication No.: US10553456B2Publication Date: 2020-02-04
- Inventor: Yasuyuki Takehara , Kazuhiko Kitano
- Applicant: J-DEVICES CORPORATION
- Applicant Address: JP Usuki
- Assignee: J-Devices Corporation
- Current Assignee: J-Devices Corporation
- Current Assignee Address: JP Usuki
- Agent Kevin B. Jackson
- Priority: JP2016-090189 20160428
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/29 ; H01L23/14 ; H01L23/13 ; H01L21/48 ; H01L23/31 ; H01L23/00 ; H01L21/768 ; H01L23/544 ; H01L23/492
Abstract:
A semiconductor package includes a substrate having at least one recessed portion, a semiconductor device located on a surface of the substrate, the surface having the at least one recessed portion, and a resin insulating layer covering the semiconductor device.
Public/Granted literature
- US20170316996A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE Public/Granted day:2017-11-02
Information query
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