Invention Grant
- Patent Title: Printed circuit board, method, and semiconductor package
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Application No.: US15165462Application Date: 2016-05-26
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Publication No.: US10553452B2Publication Date: 2020-02-04
- Inventor: Suk-Chang Hong , Hyo-Bin Park , Dong-Kwang Shin , Sang-Jin Baek
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0077303 20150601
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/538 ; H01L21/683 ; H01L23/498 ; H01L23/36 ; H01L25/10 ; H01L23/13 ; H01L23/31 ; H01L23/00
Abstract:
A printed circuit board includes first and second insulating layers forming a cavity, a first heat releasing layer formed on an exterior surface of the cavity, and a circuit layer formed above or below the first the insulating layer and at least between a surface of the cavity and the first insulating layer. The heat releasing layer is electrically connected to at least a portion of the circuit layer.
Public/Granted literature
- US20160351545A1 PRINTED CIRCUIT BOARD, METHOD, AND SEMICONDUCTOR PACKAGE Public/Granted day:2016-12-01
Information query
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