Invention Grant
- Patent Title: Multilayer capacitor including via electrodes and board having the same
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Application No.: US15595070Application Date: 2017-05-15
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Publication No.: US10553364B2Publication Date: 2020-02-04
- Inventor: Jin Ok Han , Jin Kyung Joo , Jin Ju Park , Jae Yeol Choi , Hong Seok Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0089312 20160714
- Main IPC: H01G4/40
- IPC: H01G4/40 ; H01G4/232 ; H01G2/06 ; H01G4/008 ; H01G4/018 ; H01G4/30 ; H01L21/304

Abstract:
A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively; and first and second via electrodes formed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.
Public/Granted literature
- US20180019064A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Public/Granted day:2018-01-18
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