A method of making an inductor device includes forming a first metal layer and an ILD on a substrate, patterning a trench perpendicular to the first metal layer in the ILD, and depositing a magnetic material. The method includes depositing another ILD and patterning a via adjacent to the trench that extends from the first metal layer to a surface of the ILD. The method includes patterning trenches in the ILD, with a first portion over and adjacent to and parallel to the first metal layer, and a second portion perpendicular to the first portion and extending from an end of the first portion to the via. The first metal layer and trenches are connected to through the via. The method includes depositing a metal in the via, and depositing a metal in the trenches to form a second metal layer connected to the first metal layer through the via.