Invention Grant
- Patent Title: Method for producing a foil arrangement and corresponding foil arrangement
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Application No.: US15314524Application Date: 2015-05-27
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Publication No.: US10548229B2Publication Date: 2020-01-28
- Inventor: Johannes Bock , Andreas Rebelein , Andreas Schulze , Andreas Voegerl
- Applicant: CONTI TEMIC MICROELECTRONIC GMBH
- Applicant Address: DE Nuremberg
- Assignee: Conti Temic microelectronic GmbH
- Current Assignee: Conti Temic microelectronic GmbH
- Current Assignee Address: DE Nuremberg
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE102014210483 20140603
- International Application: PCT/EP2015/061709 WO 20150527
- International Announcement: WO2015/185412 WO 20151210
- Main IPC: B21C37/00
- IPC: B21C37/00 ; H05K3/46 ; C25D3/12 ; C25D3/30 ; C25D3/48 ; C25D3/56 ; C25D3/60 ; C25D3/62 ; C25D7/06 ; H05K3/24 ; H05K3/28 ; H05K1/02
Abstract:
A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.
Public/Granted literature
- US20170215289A1 Method For Producing A Foil Arrangement And Corresponding Foil Arrangement Public/Granted day:2017-07-27
Information query
