Invention Grant
- Patent Title: Clipping method and apparatus
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Application No.: US16010259Application Date: 2018-06-15
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Publication No.: US10547481B2Publication Date: 2020-01-28
- Inventor: Jianzhong Yao
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- Main IPC: H04K1/02
- IPC: H04K1/02 ; H04L27/26 ; H04B1/04 ; H04W72/04 ; H04W72/08 ; H04W88/08

Abstract:
Embodiments of the present disclosure provide a clipping method and an apparatus. The clipping apparatus is a base station, and the base station includes a baseband unit (BBU) and a remote radio unit (RRU). The BBU includes a first processor, and the RRU includes a second processor. The first processor is configured to: perform clipping after combining N input carriers, and output N carriers obtained after a first level of clipping; and the second processor is configured to: perform clipping after combining the N carriers obtained after the first level of clipping, and output N carriers obtained after a second level of clipping, where N is an integer greater than or equal to 2. The base station separately performs clipping at the BBU and the RRU, so that the base station can flexibly select, a baseband processing board or a baseband chip to deploy the first level of clipping.
Public/Granted literature
- US20180295008A1 CLIPPING METHOD AND APPARATUS Public/Granted day:2018-10-11
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