Invention Grant
- Patent Title: High-density data communications connection assembly
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Application No.: US15864891Application Date: 2018-01-08
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Publication No.: US10547148B2Publication Date: 2020-01-28
- Inventor: David N. Warren
- Applicant: HD Networks, LLC
- Applicant Address: US FL Stuart
- Assignee: HD Networks, LLC
- Current Assignee: HD Networks, LLC
- Current Assignee Address: US FL Stuart
- Agency: McHale & Slavin, P.A.
- Main IPC: H01R3/00
- IPC: H01R3/00 ; H01R25/00 ; H01R13/717 ; H01R13/6463 ; H01R27/02 ; H01R24/64 ; H01R107/00

Abstract:
Disclosed is a system for operating a network incorporating high-density connections for increased efficiency, network operation and management. The high-density connections are incorporated into the patch panel, network switch, and cables that connects them, as well as into cable analyzers and printed circuit boards (PCBs) which allow for a complete network within a single computer running virtualization software.
Public/Granted literature
- US20180131147A1 High-density data communications connection assembly Public/Granted day:2018-05-10
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