Invention Grant
- Patent Title: Nanosheet FET including all-around source/drain contact
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Application No.: US15868742Application Date: 2018-01-11
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Publication No.: US10546957B2Publication Date: 2020-01-28
- Inventor: Peng Xu , Chun Wing Yeung , Chen Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/06 ; H01L29/423 ; H01L29/417 ; H01L29/66 ; H01L21/02 ; H01L21/306 ; H01L21/768

Abstract:
A semiconductor device includes a semiconductor wafer having one or more suspended nanosheet extending between first and second source/drain regions. A gate structure wraps around the nanosheet stack to define a channel region located between the source/drain regions. The semiconductor device further includes a first all-around source/drain contact formed in the first source/drain region and a second all-around source/drain contact formed in the second source/drain region. The first and second all-around source/drain contacts each include a source/drain epitaxy structure and an electrically conductive external portion that encapsulates the source/drain epitaxy structure.
Public/Granted literature
- US20190214502A1 NANOSHEET FET INCLUDING ALL-AROUND SOURCE/DRAIN CONTACT Public/Granted day:2019-07-11
Information query
IPC分类: