Invention Grant
- Patent Title: Opening in a multilayer polymeric dielectric layer without delamination
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Application No.: US15293557Application Date: 2016-10-14
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Publication No.: US10546821B2Publication Date: 2020-01-28
- Inventor: Licheng Marshal Han , Michael Andrew Serafin , Byron Williams , Sandra Rodriguez Varela , Salvatore Pavone
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/532 ; H01L49/02 ; H01L21/768 ; H01L21/311 ; H01L21/56 ; H01L23/29 ; H01L21/784 ; H01L23/522
Abstract:
An integrated circuit and method with a delamination free opening formed through multiple levels of polymer dielectric. The opening has a vertical sidewall and no interface between adjacent levels of polymer dielectric is exposed on the vertical sidewall.
Public/Granted literature
- US20170033057A1 OPENING IN A MULTILAYER POLYMERIC DIELECTRIC LAYER WITHOUT DELAMINATION Public/Granted day:2017-02-02
Information query
IPC分类:
