Invention Grant
- Patent Title: Assemblies which include wordlines over gate electrodes
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Application No.: US15592027Application Date: 2017-05-10
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Publication No.: US10546811B2Publication Date: 2020-01-28
- Inventor: Mitsunari Sukekawa
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L27/108 ; H01L27/105 ; H01L29/78 ; H01L27/24 ; H01L29/786 ; H01L29/66

Abstract:
Some embodiments include an assembly having bitlines extending along a first direction. Semiconductor pillars are over the bitlines and are arranged in an array. The array includes columns along the first direction and rows along a second direction which crosses the first direction. Each of the semiconductor pillars extends vertically. The semiconductor pillars are over the bitlines. The semiconductor pillars are spaced from one another along the first direction by first gaps, and are spaced from one another along the second direction by second gaps. Wordlines extend along the second direction, and are elevationally above the semiconductor pillars. The wordlines are directly over the first gaps and are not directly over the semiconductor pillars. Gate electrodes are beneath the wordlines and are coupled with the wordlines. Each of the gate electrodes is within one of the second gaps. Shield lines may be within the first gaps.
Public/Granted literature
- US20180331029A1 Assemblies Which Include Wordlines Over Gate Electrodes Public/Granted day:2018-11-15
Information query
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