Invention Grant
- Patent Title: Manufacturing process of element chip and substrate heating apparatus
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Application No.: US16008280Application Date: 2018-06-14
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Publication No.: US10546783B2Publication Date: 2020-01-28
- Inventor: Noriyuki Matsubara , Hidehiko Karasaki
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2017-126365 20170628
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L21/683 ; B23K26/364 ; H01L21/67 ; H01L21/308 ; H01L21/3065
Abstract:
Provided is a manufacturing process of an element chip, which comprises a preparing step for preparing a substrate containing element regions and dicing regions, a holding step for holding the substrate and a frame with a holding sheet, an applicating step for applying a resin material solution containing a resin constituent and a solvent on the substrate to form a coated layer containing the resin constituent and the solvent thereon, a heating step for heating the substrate held on the holding sheet through a heat shielding member shielding the frame and the holding sheet to substantially remove the solvent from the coated layer, thereby to form a resin layer, a patterning step for patterning the resin layer to expose the substrate in the dicing regions, and a dicing step for dicing the substrate into element chips by plasma-etching the substrate.
Public/Granted literature
- US20190006238A1 MANUFACTURING PROCESS OF ELEMENT CHIP AND SUBSTRATE HEATING APPARATUS Public/Granted day:2019-01-03
Information query
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