Invention Grant
- Patent Title: Field-effect transistors with improved dielectric gap fill
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Application No.: US16052085Application Date: 2018-08-01
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Publication No.: US10546775B1Publication Date: 2020-01-28
- Inventor: Wei Hong , Liu Jiang , Yongjun Shi , Yi Qi , Hsien-Ching Lo , Hui Zang
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L21/768 ; H01L27/12 ; H01L29/66 ; H01L21/28 ; H01L21/84 ; H01L21/762 ; H01L29/78

Abstract:
Structures for a field-effect transistor and methods of forming a structure for a field-effect transistor. A first dielectric layer is deposited over a first gate structure in a first device area and a second gate structure in a second device area, and then planarized. A second dielectric layer is deposited over the planarized first dielectric layer, and then removed from the first device area. After removing the second dielectric layer from the first device area, the first dielectric layer in the first device area is recessed to expose the first gate structure. A silicide is formed on the exposed first gate structure.
Public/Granted literature
- US20200043779A1 FIELD-EFFECT TRANSISTORS WITH IMPROVED DIELECTRIC GAP FILL Public/Granted day:2020-02-06
Information query
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