Invention Grant
- Patent Title: Post package repair for mapping to a memory failure pattern
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Application No.: US15753315Application Date: 2015-08-18
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Publication No.: US10546649B2Publication Date: 2020-01-28
- Inventor: Eric L Pope , Scott P Faasse
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2015/045683 WO 20150818
- International Announcement: WO2017/030564 WO 20170223
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C29/10 ; G11C29/24 ; G11C29/44

Abstract:
In one example in accordance with the present disclosure, a method includes mapping, using post-package repair, an address associated with a first memory row of a computing device to a spare memory row of the computing device, wherein the spare memory row has a memory failure pattern, and reading data from the spare memory row.
Public/Granted literature
- US20180247699A1 POST PACKAGE REPAIR FOR MAPPING TO A MEMORY FAILURE PATTERN Public/Granted day:2018-08-30
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