An inspection apparatus includes an imaging unit that captures an image of a board having a land on which a solder piece has been printed, an image of the board having a component mounted on the solder piece, or an image of the board having the component soldered to the land, a land determination unit that determines a position of an element on the board other than the land from the image of the board captured by the imaging unit, and determines a position of the land in the image based on the determined position of the element, and an inspection unit that inspects the solder piece or component on the land using the position of the land determined by the land determination unit as a reference.