Invention Grant
- Patent Title: Method for manufacturing a flexible printed circuit board
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Application No.: US16051107Application Date: 2018-07-31
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Publication No.: US10542627B2Publication Date: 2020-01-21
- Inventor: Xian-Qin Hu , Cheng-Jia Li
- Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
- Applicant Address: CN Qinhuangdao CN Shenzhen
- Assignee: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,Avary Holding (Shenzhen) Co., Limited.
- Current Assignee: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,Avary Holding (Shenzhen) Co., Limited.
- Current Assignee Address: CN Qinhuangdao CN Shenzhen
- Agency: ScienBiziP, P.C.
- Priority: CN201710949319 20171012
- Main IPC: H05K3/18
- IPC: H05K3/18 ; H05K1/18 ; H05K3/28 ; H05K3/00 ; H05K3/46

Abstract:
A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.
Public/Granted literature
- US20190116674A1 FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-04-18
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