Invention Grant
- Patent Title: MEMS structure and method of forming same
-
Application No.: US15859130Application Date: 2017-12-29
-
Publication No.: US10541627B2Publication Date: 2020-01-21
- Inventor: Yi Heng Tsai , Chia-Hua Chu , Kuei-Sung Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: G01P15/125
- IPC: G01P15/125 ; H02N1/00 ; B81B3/00 ; G01P15/08

Abstract:
A microelectromechanical system (MEMS) device includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. The MEMS device further includes a protrusion extending from the substrate and configured to contact the movable element when the movable element moves in the at least one degree of freedom, wherein the protrusion comprises a surface having a water contact angle of higher than about 15° measured in air.
Public/Granted literature
- US20180145612A1 MEMS Structure and Method of Forming Same Public/Granted day:2018-05-24
Information query
IPC分类: