Invention Grant
- Patent Title: Light emitting element and method of manufacturing the same
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Application No.: US15861539Application Date: 2018-01-03
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Publication No.: US10541513B2Publication Date: 2020-01-21
- Inventor: Tatsushi Hamaguchi , Masaru Kuramoto , Yuki Maeda , Noriyuki Futagawa
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-166571 20130809
- Main IPC: H01S5/183
- IPC: H01S5/183 ; H01S5/30 ; H01S5/02 ; H01S5/343

Abstract:
A method of manufacturing a light emitting element includes, sequentially (a) forming a first light reflecting layer having a convex shape; (b) forming a layered structure body by layering a first compound semiconductor layer, an active layer, and a second compound semiconductor layer; (c) forming, on the second surface of the second compound semiconductor layer, a second electrode and a second light reflecting layer formed from a multilayer film; (d) fixing the second light reflecting layer to a support substrate; (e) removing the substrate for manufacturing a light emitting element, and exposing the first surface of the first compound semiconductor layer and the first light reflecting layer; (f) etching the first surface of the first compound semiconductor layer; and (g) forming a first electrode on at least the etched first surface of the first compound semiconductor layer.
Public/Granted literature
- US20180145483A1 LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-05-24
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