A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed. The elements can be integrated by a standard pick and place process.