Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15365738Application Date: 2016-11-30
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Publication No.: US10541299B2Publication Date: 2020-01-21
- Inventor: Kazunobu Kuwazawa , Shigeyuki Sakuma , Hiroaki Nitta , Mitsuo Sekisawa , Takehiro Endo
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-242057 20151211
- Main IPC: H01L27/082
- IPC: H01L27/082 ; H01L29/06 ; H01L29/10 ; H01L29/732 ; H01L29/78

Abstract:
A semiconductor device includes a first conductivity type semiconductor substrate, a second conductivity type first and second buried diffusion layers that are arranged in the semiconductor substrate, a semiconductor layer arranged on the semiconductor substrate, a second conductivity type first impurity diffusion region that is arranged in the semiconductor layer, a second conductivity type second impurity diffusion region that is arranged, in the semiconductor layer, on the second buried diffusion layer, a second conductivity type first well that is arranged in a first region of the semiconductor layer, a first conductivity type second well that is arranged, in the semiconductor layer, in a second region, a first conductivity type third and fourth impurity diffusion regions that are arranged in the first well, and a first conductivity type fifth impurity diffusion region that is arranged in the second well.
Public/Granted literature
- US20170170262A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-06-15
Information query
IPC分类: