Invention Grant
- Patent Title: FinFETs with various fin height
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Application No.: US16147801Application Date: 2018-09-30
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Publication No.: US10541253B2Publication Date: 2020-01-21
- Inventor: Kangguo Cheng , Terence B. Hook , Xin Miao , Balasubramanian Pranatharthiharan
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Intelletek Law Group, PLLC
- Agent Gabriel Daniel, Esq.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/8238 ; H01L27/12 ; H01L27/11 ; H01L27/092 ; H01L21/84 ; H01L21/02 ; H01L21/306 ; H01L21/762 ; H01L29/66 ; H01L21/308 ; H01L29/78

Abstract:
A method of forming a semiconductor circuit having FinFET devices that have fins of different height is provided. There is a shallow trench isolation layer (STI) on top of a semiconductor substrate. A first Fin Field Effect Transistor (FinFET) comprises a first semiconductor fin including a first layer that extends from a common substrate level through the STI layer to a first height above a top surface of the STI layer. There is a second FinFET comprising a second semiconductor fin including the first layer that extends from the common substrate level through the STI layer to the first height above the top surface of the STI layer, plus a second layer having a second height, plus a third layer having a third height. The second semiconductor fin is taller than the first semiconductor fin.
Public/Granted literature
- US20190035816A1 FINFETS WITH VARIOUS FIN HEIGHT Public/Granted day:2019-01-31
Information query
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