Invention Grant
- Patent Title: Light emitting device package
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Application No.: US16358876Application Date: 2019-03-20
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Publication No.: US10541235B2Publication Date: 2020-01-21
- Inventor: Bong Kul Min
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2010-0051840 20100601
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L25/16 ; H01L25/075 ; H01L33/60 ; H01L33/62 ; H01L33/64 ; H01L25/13 ; H01L29/866 ; H01L33/38 ; F21K9/00 ; H01L33/50 ; H01L33/56

Abstract:
A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.
Public/Granted literature
- US20190221555A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2019-07-18
Information query
IPC分类: