Invention Grant
- Patent Title: Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines
-
Application No.: US15967191Application Date: 2018-04-30
-
Publication No.: US10541223B2Publication Date: 2020-01-21
- Inventor: Wong Hing Kuong , Samuel Capistrano, III , Peter Peh , Liu Yang , Kamal Gupta
- Applicant: Kulicke and Soffa Industries, Inc.
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Chrisopher M. Spletzer, Sr.
- Main IPC: B23K20/00
- IPC: B23K20/00 ; H01L23/00 ; B23K37/04 ; B23K101/40
Abstract:
A method of operating a wire bonding machine is provided. The method includes the steps of: (a) supporting a substrate on a material handling system of the wire bonding machine; (b) changing a bend profile of the substrate; and (c) securing, after step (b), the substrate against a support structure of the wire bonding machine using a clamping element of the wire bonding machine, the support structure for supporting the substrate during a wire bonding operation, and the clamping element for securing the substrate to the support structure during the wire bonding operation.
Public/Granted literature
Information query
