Invention Grant
- Patent Title: Semiconductor module, base plate of semiconductor module, and method of manufacturing semiconductor device
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Application No.: US15943570Application Date: 2018-04-02
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Publication No.: US10541219B2Publication Date: 2020-01-21
- Inventor: Yoshinori Uezato
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: JP2017-098567 20170517
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/367 ; H01L23/40 ; H01L23/492

Abstract:
A base plate having concave curved portions (rearward-convex parts) curved in a rearward direction to be convex and have a predetermined curvature, is fixed to a surface of a cooling fin while being in contact with the surface of the cooling fin at vertices of the rearward-convex parts. A stacked substrate is bonded on a front surface of the base plate, at an area opposing the rearward-convex part. A spacer is provided on a rear surface of the base plate, at a position closer than an edge of a solder layer to a perimeter of the base plate. The spacer is sandwiched between the base plate and the cooling fin when a screw for fixing the base plate to the cooling fin is tightened and the spacer has a function of suppressing deformation of the base plate.
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