Invention Grant
- Patent Title: Interconnect structure including air gaps enclosed between conductive lines and a permeable dielectric layer
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Application No.: US15479983Application Date: 2017-04-05
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Publication No.: US10541206B2Publication Date: 2020-01-21
- Inventor: Benjamin D. Briggs , Lawrence A. Clevenger , Christopher J. Penny , Michael Rizzolo
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H01L23/532 ; H01L21/764 ; H01L21/02 ; H01L21/3213 ; H01L21/768 ; H01L21/311
Abstract:
A method of forming an interconnect to an electrical device is provided. The structure produced by the method may include a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parallel lengths; and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.
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