Invention Grant
- Patent Title: Maintenance method of plasma processing apparatus
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Application No.: US16094986Application Date: 2017-04-10
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Publication No.: US10541142B2Publication Date: 2020-01-21
- Inventor: Kazuya Matsumoto , Yuki Hosaka , Mitsunori Ohata , Takashi Yamamoto
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2016-085347 20160421
- International Application: PCT/JP2017/014697 WO 20170410
- International Announcement: WO2017/183507 WO 20171026
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; H01L21/687 ; H01J37/32 ; H01L21/683 ; H05H1/46
Abstract:
A plasma processing apparatus includes a support structure configured to support a workpiece and a first drive device configured to rotate the support structure about a first axis extending in a direction orthogonal to a vertical direction. The support structure includes a holding unit including an electrostatic chuck and a container provided under the holding unit. The container includes a tubular container body, and a bottom cover configured to close a bottom side opening of the container body and to be detachable from the container body. A maintenance method includes: rotating a support structure about a first axis such that the bottom cover is positioned above an electrostatic chuck, removing the bottom cover from the container body, and maintaining a component provided in the container body.
Public/Granted literature
- US20190131137A1 MAINTENANCE METHOD OF PLASMA PROCESSING APPARATUS Public/Granted day:2019-05-02
Information query
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