- Patent Title: Chip resistor and paste for forming resist layer of chip resistor
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Application No.: US16193608Application Date: 2018-11-16
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Publication No.: US10541069B2Publication Date: 2020-01-21
- Inventor: Jang-Seok Yun
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2017-0160854 20171128
- Main IPC: H01C7/00
- IPC: H01C7/00 ; H01C1/14 ; H01C17/065 ; H01B1/02 ; H01C1/034 ; C22C9/00
Abstract:
A paste for forming a resist layer of a resistor includes: a copper-based alloy powder; and nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder, wherein the paste is glass-free.
Public/Granted literature
- US20190164672A1 CHIP RESISTOR AND PASTE FOR FORMING RESIST LAYER OF CHIP RESISTOR Public/Granted day:2019-05-30
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