Invention Grant
- Patent Title: Multilayer stack with enhanced conductivity and stability
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Application No.: US15851002Application Date: 2017-12-21
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Publication No.: US10541065B2Publication Date: 2020-01-21
- Inventor: Patrick John Kinlen , Matthew Flack , Eric Alan Bruton
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: H01B1/12
- IPC: H01B1/12 ; H01C7/00 ; H01C17/065 ; H01C17/24 ; H05B3/14 ; H01C17/26 ; H01C7/18 ; H01C1/16 ; H01B1/22 ; H01B1/24 ; H01B3/00 ; H01B7/02 ; B64D45/02 ; H01C7/02 ; H01C17/28 ; B64D15/12 ; H01C1/142

Abstract:
An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
Public/Granted literature
- US20190198188A1 Multilayer Stack with Enhanced Conductivity and Stability Public/Granted day:2019-06-27
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