Invention Grant
- Patent Title: Semiconductor apparatus related to the repairing of a redundancy region
-
Application No.: US16153007Application Date: 2018-10-05
-
Publication No.: US10541045B2Publication Date: 2020-01-21
- Inventor: Keun Sik Ko
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2018-0029129 20180313
- Main IPC: G11C29/44
- IPC: G11C29/44 ; G11C17/16 ; G11C17/18

Abstract:
A semiconductor apparatus includes a fuse array, a word line decoder, a bit line decoder, a bank information comparison circuit, and a rupture circuit. The word line decoder is configured to select a word line of the fuse array based on a bank select address signal. The bit line decoder is configured to select a bit line of the fuse array based on a fail row address signal. The bank information comparison circuit and the rupture circuit are configured to rupture a fuse coupled to the word line and the bit line when a fail bank address signal and the bank select address signal correspond to each other.
Public/Granted literature
- US20190287641A1 SEMICONDUCTOR APPARATUS RELATED TO THE REPAIRING OF A REDUNDANCY REGION Public/Granted day:2019-09-19
Information query