Invention Grant
- Patent Title: Apparatus for bonding laminate structures
-
Application No.: US15437680Application Date: 2017-02-21
-
Publication No.: US10538037B2Publication Date: 2020-01-21
- Inventor: Richard L. Kulesha
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Miller, Matthias & Hull LLP
- Main IPC: B32B7/08
- IPC: B32B7/08 ; B60J10/00 ; A61F13/15 ; B29C65/00 ; B32B37/00 ; C08J5/00 ; B65C3/20 ; B30B5/02 ; B30B5/04 ; B30B15/34 ; B29C65/56 ; B29C65/18 ; B29C70/54 ; B29C65/60 ; B29C70/24 ; B25C5/00 ; B25C5/11 ; B29C65/02 ; B25C5/06

Abstract:
A composite laminate reinforcing tool may be used to form a reinforced joint at a bond line of a composite laminate structure. The tool may hold one or more clips having posts, and the tool may be positioned along the bond line between at least two composite laminate elements. Joint sections of the clip may be heated to increase a pliability of the joint section, and the tool may be actuated to drive the post through the at least two composite laminate elements. The posts may be deflected toward a base of the clip, thereby to seat the clip. The reinforced composite laminate structure may then be cured.
Public/Granted literature
- US20170165900A1 Apparatus for Bonding Laminate Structures Public/Granted day:2017-06-15
Information query