Invention Grant
- Patent Title: Multilayer capacitor built-in substrate
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Application No.: US15830233Application Date: 2017-12-04
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Publication No.: US10531565B2Publication Date: 2020-01-07
- Inventor: Yukihiro Fujita
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-235742 20161205
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/16 ; H05K1/18 ; H01G4/08 ; H01G4/12 ; H01G4/30 ; H01G4/38 ; H01G4/228 ; H01G4/232 ; H01G2/02 ; H01G2/06 ; H01G4/248 ; H01G4/012

Abstract:
A multilayer capacitor built-in substrate includes a core substrate, a multilayer capacitor mounted on one principal surface of the core substrate, and a burying layer provided on the one principal surface of the core substrate to bury the multilayer capacitor. The multilayer capacitor includes a laminated body in which dielectric layers and internal electrode layers are laminated, and first and second external electrodes. The laminated body includes an effective region in which internal electrode layers respectively connected to the first external electrode and the second external electrode are laminated with a dielectric layer located therebetween, and a non-effective region surrounding the effective region. The core substrate includes, on the one principal surface, a first land electrode electrically connected to the first external electrode and a second land electrode electrically connected to the second external electrode.
Public/Granted literature
- US20180160541A1 MULTILAYER CAPACITOR BUILT-IN SUBSTRATE Public/Granted day:2018-06-07
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