Invention Grant
- Patent Title: Hexagonal semiconductor package structure
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Application No.: US15232443Application Date: 2016-08-09
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Publication No.: US10530175B2Publication Date: 2020-01-07
- Inventor: Tzu-Sung Huang , Chen-Hua Yu , Hao-Yi Tsai , Hung-Yi Kuo , Ming Hung Tseng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01F27/42
- IPC: H01F27/42 ; H01F37/00 ; H01F38/00 ; H02J7/02 ; H02J50/80 ; H02J50/10 ; H01F27/28 ; H01F38/14 ; H01F41/04 ; H01F41/10 ; H01L49/02 ; H01F17/00

Abstract:
Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.
Public/Granted literature
- US20180048177A1 Hexagonal Semiconductor Package Structure Public/Granted day:2018-02-15
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