Invention Grant
- Patent Title: Modular plug connector with multilayer PCB for very high speed applications
-
Application No.: US16262696Application Date: 2019-01-30
-
Publication No.: US10530106B2Publication Date: 2020-01-07
- Inventor: Andrew David Baum , Richard D. Marowsky , David Henry Gutter , Yakov Belopolsky , Jennifer L. Allison , Mark Ellis
- Applicant: Bel Fuse (Macao Commercial Offshore) Limited
- Applicant Address: unknown Macau
- Assignee: Bel Fuse (Macao Commercial Offshore) Limited
- Current Assignee: Bel Fuse (Macao Commercial Offshore) Limited
- Current Assignee Address: unknown Macau
- Agency: Patterson Intellectual Property Law, P.C.
- Agent Gary L. Montle
- Main IPC: H01R24/64
- IPC: H01R24/64 ; H01R13/6469 ; H01R13/506 ; H01R13/6587 ; H01R13/514 ; H01R13/6466 ; H01R13/66 ; H01R13/6585 ; H01R107/00 ; H01R13/627 ; H01R13/6599

Abstract:
A modular RJ45-type plug apparatus is provided for forming a connector interface with a connector jack in a high speed data transmission network. A housing comprises an insulative front portion and a conductive shield portion attachable to define an interior, within which is positioned a contact subassembly including a first PCB having cable mounting pads on one end and through holes for elongate plug contacts on the other end. The contacts are connected on one end to the first PCB and on a second end to a second PCB, with bridge portions therebetween collectively defining a jack contact interface. The second PCB comprises desired electrical characteristics which provide the apparatus with certain capacitance compensation properties, wherein the capacitance compensation is offset from a signal path defined between the jack-plug connector interface and the cable pairs.
Public/Granted literature
- US20190237920A1 MODULAR PLUG CONNECTOR WITH MULTILAYER PCB FOR VERY HIGH SPEED APPLICATIONS Public/Granted day:2019-08-01
Information query