Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15897162Application Date: 2018-02-15
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Publication No.: US10529800B2Publication Date: 2020-01-07
- Inventor: Kaname Mitsuzuka , Yuichi Onozawa , Takahiro Tamura
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2017-026875 20170216; JP2017-240871 20171215
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/10 ; H01L27/06 ; H01L29/739

Abstract:
A semiconductor device is provided, including: a semiconductor substrate having an active area and an edge termination region; an upper electrode; an insulating film provided between the semiconductor substrate and the upper electrode and having a contact hole; a first conductivity-type drift region; a second conductivity-type base region; a second conductivity-type well region; and a second conductivity-type extension region formed extending in a direction toward the well region from the base region and separated from the upper electrode by the insulating film, wherein a sum of a first distance from an end portion of the contact hole closer to the well region to an end portion of the extension region closer to the well region and a second distance from the end portion of the extension region closer to the well region to the well region is smaller than a thickness of the semiconductor substrate in the active area.
Public/Granted literature
- US20180233554A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-08-16
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