Invention Grant
- Patent Title: Package structure and method of forming the same
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Application No.: US15366996Application Date: 2016-12-01
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Publication No.: US10529697B2Publication Date: 2020-01-07
- Inventor: Hsi-Kuei Cheng , Ching Fu Chang , Chih-Kang Han , Hsin-Chieh Huang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/48 ; H01L25/10 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L21/78 ; H01L25/065 ; H01L25/16 ; H01L25/00 ; H01L23/498 ; H01L23/538
Abstract:
An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.
Public/Granted literature
- US20180082988A1 PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2018-03-22
Information query
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