Invention Grant
- Patent Title: Package structures and methods of forming the same
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Application No.: US15675288Application Date: 2017-08-11
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Publication No.: US10529690B2Publication Date: 2020-01-07
- Inventor: Ying-Ching Shih , Chi-Hsi Wu , Chen-Hua Yu , Chih-Wei Wu , Jing-Cheng Lin , Pu Wang , Szu-Wei Lu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L25/065 ; H01L23/00 ; H01L25/07 ; H01L25/11 ; H01L25/00 ; H01L21/56 ; H01L25/18 ; H01L23/31
Abstract:
An embodiment is a method including bonding a first die to a first side of an interposer using first electrical connectors, bonding a second die to first side of the interposer using second electrical connectors, attaching a first dummy die to the first side of the interposer adjacent the second die, encapsulating the first die, the second die, and the first dummy die with an encapsulant, and singulating the interposer and the first dummy die to form a package structure.
Public/Granted literature
- US20180138151A1 PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME Public/Granted day:2018-05-17
Information query
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