Invention Grant
- Patent Title: Method and apparatus for power delivery to a die stack via a heat spreader
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Application No.: US15965425Application Date: 2018-04-27
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Publication No.: US10529677B2Publication Date: 2020-01-07
- Inventor: Dmitri Yudanov
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Timothy M. Honeycutt
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L23/64 ; H01L23/528 ; H01L25/065 ; H01L23/00 ; H01L23/31 ; H01L23/34
Abstract:
Various chip stack power delivery circuits are disclosed. In one aspect, an apparatus is provided that includes a stack of semiconductor chips that has an uppermost semiconductor chip and a lowermost semiconductor chip. A heat spreader is positioned on the uppermost semiconductor chip. A power transfer circuit is configured to transfer electric power from the heat spreader to the uppermost semiconductor chip.
Public/Granted literature
- US20190333876A1 METHOD AND APPARATUS FOR POWER DELIVERY TO A DIE STACK VIA A HEAT SPREADER Public/Granted day:2019-10-31
Information query
IPC分类:
