A semiconductor structure includes a first die; a first molding encapsulating the first die; a second die disposed over the first molding, and including a first surface, a second surface opposite to the first surface, and a sidewall between the first surface and the second surface; and a second molding disposed over the first molding and surrounding the second die, wherein the first surface of the second die faces the first molding, and the second die is at least partially covered by the second molding.