An electronic device includes a first substrate, a first conductor, a first insulation layer, a second substrate, a second conductor, a second insulation layer. The first substrate has a first surface. The first conductor is disposed on the first surface of the first substrate. The first insulation layer is on the first conductor. The second substrate has a second surface facing toward the first surface of the first substrate. The second conductor is disposed on the second surface of the second substrate. The second insulation layer is on the second conductor. The first insulation layer is in contact with a sidewall of the second conductor. The second insulation layer is in contact with a sidewall of the first conductor. A coefficient of thermal expansion (CTE) of the first insulation layer is greater than a CTE of the first conductor.