Invention Grant
- Patent Title: Electronic components with integral lead frame and wires
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Application No.: US15677578Application Date: 2017-08-15
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Publication No.: US10529653B2Publication Date: 2020-01-07
- Inventor: Federico Giovanni Ziglioli
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Slater Matsil, LLP
- Priority: ITTO2015A0230 20150424
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/00
Abstract:
An electronic component includes one or more circuits having electrical connections coupled therewith. The electrical connections include a lead frame as well as electrical wires coupling the circuit or circuits to respective portions of the lead frame. The electrical wires may be formed as one piece with the respective portion of the lead frame without joints therebetween, e.g., by 3D printing.
Public/Granted literature
- US20180012827A1 Electronic Components with Integral Lead Frame and Wires Public/Granted day:2018-01-11
Information query
IPC分类:
