Invention Grant
- Patent Title: Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package
-
Application No.: US15964092Application Date: 2018-04-27
-
Publication No.: US10529593B2Publication Date: 2020-01-07
- Inventor: Po-Han Wang , Hung-Jui Kuo , Yu-Hsiang Hu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/31 ; H01L23/367 ; H01L23/04 ; H01L25/00 ; H01L21/48 ; H01L25/065 ; H01L23/498
Abstract:
A semiconductor package manufacturing method thereof are provided. The semiconductor package includes a high-power device die, a redistribution structure, a heat dissipation module and a molding compound. The high-power device die has a front side and a back side opposite to the front side. The redistribution structure is disposed at the front side. The heat dissipation module is in direct contact with the back side. The molding compound is disposed between the redistribution structure and the heat dissipation module, and surrounding the high-power device die. The molding compound has a body portion and an extended portion. An interface between the body portion and the heat dissipation module is substantially parallel to the back side of the high-power device die. A thickness of the extended portion is greater than a thickness of the body portion.
Public/Granted literature
- US20190333782A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-10-31
Information query
IPC分类:
