Invention Grant
- Patent Title: Signal feedback apparatus
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Application No.: US16143462Application Date: 2018-09-27
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Publication No.: US10529508B2Publication Date: 2020-01-07
- Inventor: Shang-Tsai Wu
- Applicant: DINKLE ENTERPRISE CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: DINKLE ENTERPRISE CO., LTD.
- Current Assignee: DINKLE ENTERPRISE CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H01H15/10
- IPC: H01H15/10 ; H01H71/02 ; H01H71/00 ; H01H71/08

Abstract:
A liquid-cooled heat dissipation apparatus includes a base (10), a telesignaling linkage member (20), a sliding plate (30) and a switch module (40). The telesignaling linkage member (20) is moveably installed on the base (10). The sliding plate (30) is installed corresponding to the telesignaling linkage member (20) and generates a movement along with the telesignaling linkage member (20). The switch module (40) includes a microswitch (41) arranged corresponding to the sliding plate (30) such that the microswitch (41) is operably opened or closed based on the movement of the sliding plate (30). Accordingly, through the opening and closing of the microswitch, the telesignaling monitoring on the functional module state can be achieved.
Public/Granted literature
- US20190035575A1 SIGNAL FEEDBACK APPARATUS Public/Granted day:2019-01-31
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