Invention Grant
- Patent Title: Thin-film capacitor
-
Application No.: US15725571Application Date: 2017-10-05
-
Publication No.: US10529495B2Publication Date: 2020-01-07
- Inventor: Hiroshi Takasaki , Masahiro Hiraoka , Hitoshi Saita , Kenichi Yoshida
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2016-200164 20161011
- Main IPC: H01G4/33
- IPC: H01G4/33 ; H01G4/232 ; H01G4/005 ; H01G4/40 ; H01G7/06 ; H01L49/02 ; H01G4/30 ; H01G4/012 ; H01G4/12

Abstract:
A thin-film capacitor includes a capacitor section in which electrode layers and dielectric layers are alternately stacked and which includes a hole portion that extends to the electrode layer. In a cross-section which is perpendicular to a stacking surface of the capacitor section and which passes through the hole portion, a side surface of the hole portion extends along a reference line extending in a direction intersecting the stacking surface, the dielectric layer extends up to the reference line toward the hole portion, and a gap is formed between the side surface of the pair electrode layer and the reference line.
Public/Granted literature
- US20180102220A1 THIN-FILM CAPACITOR Public/Granted day:2018-04-12
Information query