Invention Grant
- Patent Title: Heat exchanger, header for the same and manufacturing method thereof
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Application No.: US15698984Application Date: 2017-09-08
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Publication No.: US10527366B2Publication Date: 2020-01-07
- Inventor: Dong Hyun Kim , Jun Kyu Jung , Young Min Kim , Hayase Gaku
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2016-0118200 20160913
- Main IPC: F28F9/02
- IPC: F28F9/02 ; B21D53/04 ; F28D1/053

Abstract:
A heat exchanger includes a plurality of tubes having refrigerant flowing therein and arranged to exchange heat with outside air; and a header having a chamber adapted to distribute the refrigerant to the plurality of tubes, wherein the header includes, a base wall having a plurality of tube insertion holes into which the plurality of tubes are inserted, and a partition wall integrally formed with the base wall and configured to divide the chamber into a plurality of sections corresponding to the plurality of tubes. This structure helps reduce the number of parts of the heat exchanger, simplify processing and assembling, and improving the heat transfer performance by improving the distribution of the refrigerant.
Public/Granted literature
- US20180073819A1 HEAT EXCHANGER, HEADER FOR THE SAME AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-03-15
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