- Patent Title: Semiconductor package device and method of manufacturing the same
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Application No.: US16007745Application Date: 2018-06-13
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Publication No.: US10497657B1Publication Date: 2019-12-03
- Inventor: Wen-Long Lu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00
Abstract:
A semiconductor package device is provided that includes a first circuit layer having a first conductive layer and a first stud bump and a second circuit layer having a second conductive layer and a second stud bump. The first stud bump has a first portion and a second portion, and the second portion of the first stud bump is electrically connected to the second conductive layer. The second stud bump has a first portion and a second portion, and the second portion of the second stud bump is electrically connected to the first conductive layer. The first stud bump partially overlaps the second stud bump in a direction substantially perpendicular to the first circuit layer.
Public/Granted literature
- US20190385961A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-12-19
Information query
IPC分类:
