Invention Grant
- Patent Title: Mask blank, phase-shift mask, and method of manufacturing semiconductor device
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Application No.: US16201344Application Date: 2018-11-27
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Publication No.: US10495966B2Publication Date: 2019-12-03
- Inventor: Osamu Nozawa , Hiroaki Shishido , Kazuya Sakai
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2013-004370 20130115; JP2013-046721 20130308; JP2013-112549 20130529
- Main IPC: G03F1/32
- IPC: G03F1/32 ; G03F1/26 ; G03F7/20 ; H01L21/027 ; G03F1/54

Abstract:
Provided is a mask blank in which uniformity of the composition and optical characteristics of a phase-shift film in the in-plane direction and direction of film thickness is high, uniformity of the composition and optical characteristics of the phase-shift film between a plurality of substrates is also high, and defectivity is low even if a silicon-based material is applied to the material that forms the phase-shift film.A mask blank is provided in which a phase-shift film is provided on a transparent substrate, the phase-shift film having a function to transmit ArF exposure light therethrough at a predetermined transmittance and generate a predetermined amount of phase shift in the ArF exposure light that is transmitted therethrough, wherein the phase-shift film comprises a structure in which a low transmission layer and a high transmission layer are laminated, the low transmission layer and the high transmission layer are formed from a material consisting of silicon and nitrogen or a material consisting of silicon, nitrogen and one or more elements selected from semi-metallic elements, non-metallic elements and noble gases, and the low transmission layer has a relatively low nitrogen content in comparison with the high transmission layer.
Public/Granted literature
- US10539866B2 Mask blank, phase-shift mask, and method of manufacturing semiconductor device Public/Granted day:2020-01-21
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